APEXNOLOGY CO., LTD.
PCB Manufacturing, PCBA, and Electronic Components Services, Active in the Global Market.
(1) UL approval up to 5 oz.2. High layer count and HDI.
(2) Sample run up to 14 oz.
(3) Apply sequential lamination to build blinded and buried hole.
(4) Metal core/base PCB, imbedded coin technology available.
(5) 100% Hi-Pot test.
(1) Super low loss laminates up to Df 0.0001.3. We offer the following new energy products:
(2) Hybrid technology for cost down demand.
(3) High layers count up to 40 layers.
(4) Cutting edge equipment: Pin lamination, DI/LDI, pulse copper plating.
(5) Apply permanganate + plasma clean desmear to achieve high reliability.
(6) CCD back drill to expand wide range of blind hole type.
(7) Controlled impedance.
(1) Metal core/Heavy copper for EV charging station or electric power station.4. Focus on Rogers RO4350B/R04003C, RO3003, RO4850, RO4450 and other materials.
(2) Signal collected strip unit (FPC) for battery.
(3) Automotive standard product.
(4) DFM for automotive products.
(5) “Zero-defect” approach.
(6) Long-term reliability.
(7) Traceability up to 15 years.
(8) Compliance to IATF16949.
We offer sequential lamination with FR4, RO4450, FR2828 prepreg as following stack up: