As a base board used to accommodate bare chips, IC substrate is used to support, secure and protect the IC chip and it also provides thermal dissipation tunnels. There are wires inside the IC substrate for electrically connecting the chip and the printed circuit board, so it is an intermediate product for linking up chips and PCB. IC Substrate demands finer traces, smaller pads and holes, higher wiring density, greater pin numbers, more compact volume and ultra-thin core. Precise inter-layer alignment, pattern imaging, electrolytic plating, drilling and surface treatment are essential to the manufacturing of IC substrates.
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