Flexible Printed Circuits (FPC)

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Flexible Printed Circuits (FPCs) build circuit patterns by image transfer and etching processes on flexible copper cladded laminate (FCCL). The outer layers and inner layers of double-sided and multi-layer FPCs are connected through direct metallization of drilled holes. The base material of FCCL, adhesive layers and cover lay are polyimide (PI). APEXNOLOGY produces single-sided, double-sided and multi-layer FPCs.

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