The Metal Core Printed Circuit Board (MCPCB) consists of three parts: circuit layer (copper foil), insulating dielectric layer, and metal substrate. The metal base material serves as the substrate, with an insulating dielectric layer attached to the surface, and together with the copper foil on the base material, wires are formed. It has the characteristics of good heat dissipation performance and good processing performance. At present, the most widely used ones are aluminum substrate and copper substrate.
The ceramic substrates are electronic substrates made of ceramic materials. It is an inorganic material. Usually, aluminum oxide (Al2O3), aluminum nitride (AlN) and silicon nitride (Si3N4) are the main components. Ceramic substrates have good thermal properties. With its characteristics such as conductivity, high frequency, and high temperature stability, it is widely used in electronic equipment in harsh environments such as high power, high frequency, and high temperature.
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