Technology advances, and consumers yearn for electronic products with better portability, more functions and higher speed. Electronic products are getting even miniature, lighter, thinner and more intelligent. They are packed with more functions. To adapt for these requirements, printed circuit boards (PCBs) are moving to high-density interconnect (HDI), which achieves higher wiring density and finer lines of PCB through blind /buried via connection technology. The size of HDI board is getting smaller, yet it realizes higher wiring density. APEXNOLOGY mainly delivers 1+N+1, 2+N+2, 3+N+3 and any layer (every layer inter-connected, ELIC). The minimum line width /line spacing is 0.04mm/0.04mm.
APEXNOLOGY CO., LTD.
